Integratged circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit device

ABSTRACT

An integrated circuit characterization printed circuit board and method are provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of an integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of application Ser. No. 10/405,940,filed Apr. 2, 2003, pending.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to the field of integratedcircuit testing. More particularly, the present invention relates to thefield of coupling integrated circuit devices to test equipment fordevice characterization.

2. State of the Art

Development of new integrated circuit devices includes performancecharacterization of the devices for design integration purposes and forthe publication of data sheet specifications relating to the integratedcircuit device. Conventional characterization of an integrated circuitdevice has utilized a socket or other reusable coupling device forreceiving the integrated circuit device-under-characterization. However,the utilization of a socket for characterization of an integratedcircuit device introduces significant mechanical coupling to theelectrical contacts of the integrated circuit device-under-test. Such anintroduction of an extensive mechanical interface further introducessignificant electrical impedance contributions to the characterizationprocess that yet requires inherent characterization of the introducedsocket components. Generally, viewing an integrated circuit devicethrough a socket in and of itself requires significant characterizationof the socket. Additionally, a reusable mechanical coupling device, suchas a socket, introduces further characterization variations due to thenonrepeatable coupling nature resulting in inconsistent socket contactpressure and alignment as well as integrated circuit device pinorientation variations.

With regard to former socket characterization approaches, thesemiconductor testing discipline has yet to reach a consensus on arepresentative test methodology for characterization of a socket. Forexample, some socket characterization methodologies utilize a shortingplate for determining the characteristic impedance of the socket whileother approaches advocate an open-circuit methodology wherein the socketpins are open-circuited and electrically driven with a variable signalwhile searching for a resonant frequency from which the impedance may becalculated. Therefore, the socket impedance calculation according toaccepted methodologies for socket characterization is grosslyapproximate at best. Therefore, it would be desirable to characterize anintegrated circuit device in an environment that minimizes theintroduction of extraneous impedance-contributing structures as well asprovides a consistent contact characterization environment for multiplepins of a multipin integrated circuit device.

BRIEF SUMMARY OF THE INVENTION

An integrated circuit characterization printed circuit board is providedfor improving the uniformity of impedance introduced by a test fixtureacross all of the contacts or pins of an integrated circuit device. Inone embodiment of the present invention, a printed circuit board isprovided for mechanically and electrically coupling between anintegrated circuit device-under-characterization and the respective testequipment. The printed circuit board includes an array of substantiallysimilar test contacts numbering greater than the pins of the integratedcircuit device. The array of test contacts includes (i) an activeportion configured for electrically coupling with the corresponding pinson the integrated circuit device and (ii) an inactive portion adjacentto the active portion and electrically coupled to a reference signal onthe printed circuit board.

In another embodiment of the present invention, a method formanufacturing the printed circuit board is provided by forming thestructures, including the substantially similar contact pins of both theactive and inactive portions. Additionally, a method of characterizingan integrated circuit device is provided including forming the printedcircuit board, coupling the integrated circuit device to the printedcircuit board and subjecting the combined assembly to the test equipmentsignals.

In yet a further embodiment, a test system for characterizing anintegrated circuit is provided by electrically coupling a printedcircuit board that provides uniformity of impedance to all contact pinson a integrated circuit undergoing characterization. The printed circuitboard is electrically coupled to test equipment for the performance of acharacterization test of an integrated circuit device.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the drawings, which illustrate what is currently considered to be thebest mode for carrying out the invention:

FIG. 1 illustrates interrelated capacitances of an array of contact padson a printed circuit board;

FIGS. 2A and 2B illustrate arrays of contact pads, configured inaccordance with embodiments of the present invention;

FIG. 3 is a cross-sectional diagram of a printed circuit boardconfigured for testing an integrated circuit device, in accordance withan embodiment of the present invention;

FIGS. 4 and 4A are plan views of a device-side of a PCB configured forcharacterizing an integrated circuit device, in accordance with anembodiment of the present invention;

FIG. 5 is a detailed cross-sectional diagram of an alignment structurefor improving repeatability of alignment of an integrated circuit devicewith a PCB during characterization of the device, in accordance with anembodiment of the present invention; and

FIG. 6 is a circuit diagram including an electrical circuit for reducingthe inserted impedance between an integrated circuitdevice-under-characterization and associated test equipment, inaccordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides a method and circuit for more closelystandardizing the electrical conditions presented to pins or contacts ofan integrated circuit device that is undergoing a characterizationprocess for determining the performance and capabilities of theintegrated circuit device. As mentioned, prior approaches utilizedless-repeatable coupling mechanisms (e.g., sockets) for interfacingbetween an integrated circuit device-under-characterization and theassociated test equipment. The various embodiments of the presentinvention facilitate a more uniform environment to minimize introducedextraneous impedance components associated with providing the interfacebetween the integrated circuit device and the test equipment.

FIG. 1 illustrates an array of contact pads on a printed circuit board(PCB), and a portion of the contact pad capacitances of representativepads, resulting from the configuration of the array. An array of contactpads 2 is illustrated as a single combined array; however, for purposesof illustration of the associated capacitances, two individual contactpads 4, 40 of the array of contact pads 2 are illustrated with twocontact pad groupings, a first group surrounding contact pad 4 and asecond group surrounding contact pad 40. FIG. 1 illustrates each of thecontact pads of the array of contact pads 2 as being “active” contactpads. As used herein, “active” contact pads means pads that couple orare for coupling with corresponding pins, leads or contacts (hereinafter“pins”) of an integrated circuit device. Furthermore, as used herein,“inactive” contact pads means contact pads that are present as part ofthe array of contact pads, but are not arranged for placement orcoupling to pins of the integrated circuit device. Furthermore, as usedherein, the term “integrated circuit device” includes not only memorydevices but also microprocessors, signal processors and other forms ofintegrated circuits.

In FIG. 1, a contact pad 4 is illustrated as being surrounded by othercontact pads, 6-20 which are also illustrated as being active contactpads for further coupling with pins of an integrated circuit device. Itis appreciated by those of ordinary skill in the art that the couplingof a PCB to an integrated circuit device for the characterizationprocess of, for example, the capacitance associated with contact pad 4introduces additional capacitance as seen by contact pad 4. By way ofexample, FIG. 1 illustrates capacitances 22-36 resulting from therespective adjacent orientation of contact pads 6-20 which surroundactive contact pad 4. Those of ordinary skill in the art appreciate thatthe capacitance measured at contact pad 4 prior to the coupling of theintegrated circuit device therewith varies significantly from theresultant capacitance as seen at active contact pad 4 once theintegrated circuit device has been coupled therewith.

Similarly, active contact pad 40 of FIG. 1 is partially surrounded byother active contact pads 42-50 which exhibit respective capacitances52-60 as seen at active contact pad 40. As illustrated, however, thecapacitances as observed at active contact pad 4 and active contact pad40 differ significantly. Therefore, characterization of any integratedcircuit device coupled therewith results in an individualizedcharacterization of the extraneous capacitances as observed at variousactive contact pads, for example, active contact pads 4 and 40.Therefore, it would be desirable to define a structure and methodcapable of providing a more uniform interface between an integratedcircuit device-under-characterization and the respective test equipmentto provide improved uniformity across the active contact pads of thearray of contact pads 2.

An embodiment of the present invention provides a more uniformlyintroduced impedance across each of the active contact pads in the arrayof active contact pads. This uniformity improves the ability tocharacterize the impedance introduced by the coupling mechanism (e.g.,the PCB) between the integrated circuit device and the test equipment,thereby simplifying the removal of the PCB-introduced impedance whencharacterizing the performance of the integrated circuit deviceindividually, such as, for example, for reporting in integrated circuitdevice data sheets.

FIGS. 2A and 2B illustrate exemplary contact pad arrangements, inaccordance with embodiments of the present invention. In FIG. 2A, anarray of contact pads 62 includes a group of active contact pads 64-82configured on a PCB for coupling with corresponding pins of anintegrated circuit device. For clarity, the corresponding capacitancesassociated with each of the active contact pads 64-82 are notillustrated; however, they are consistent with the capacitancesillustrated in FIG. 1. Array of contact pads 62, in accordance with oneembodiment of the present invention, further includes an arrangement ofinactive contact pads 84-98, separated by a hypothetical boundaryillustrated as dashed line 100. Inactive contact pads 84-98 create anelectrical extension of the array of active contact pads, for purposesof consistency in the characterization process, and are furtherfabricated using techniques and processes reusable and consistent withthe formation of active contact pads 64-82.

FIG. 2B illustrates another exemplary arrangement of an array of contactpads, in accordance with another embodiment of the present invention. Anarray of contact pads 102 includes an arrangement of active contact pads104-122 and inactive contact pads 124-158 forming an extension of thearrangement of the active contact pads, illustrated as being separatedby a hypothetical boundary illustrated as dashed line 160. In thepresent embodiment, the geometry of the contact pads is further extendedto simulate a more consistent arrangement and present more consistentimpedance characteristics to each of the active contact pads, therebyallowing a more consistent calculation of the impedance contributions ofeach active contact pad between the integrated circuit device and thetest equipment.

FIG. 3 illustrates a test system 161 including a printed circuit board(PCB) 162 for providing the coupling interface between an integratedcircuit device 164 and characterization test equipment 166. Whilevarious packaging embodiments for an integrated circuit device arecontemplated, for illustrative purposes the present illustration depictsthe integrated circuit device as including a Ball Grid Array (BGA)contact pin interface and one or more integrated circuits. Integratedcircuit device 164 includes a BGA of active contact pins 168 configuredfor making electrical connection to the integrated circuits (not shown)within integrated circuit device 164.

Printed circuit board 162 includes a top or first side 170 having acorresponding array of active contact pads 172 wherein the configurationand dimension of the array of active contact pads 172 include activecontact pads 174-180. The location of each of active contact pads174-180 corresponds to and is configured to make contact with acorresponding active contact pin 168 of integrated circuit device 164.PCB 162 may be configured as a typical multilayer circuit board, thegeneral configuration and materials of which are known to those ofordinary skill in the art. PCB 162 further includes active test contacts182-188 for coupling the active contact pins 168 with the correspondingprobes or contacts of test equipment 166. Active test contacts 182-188include, in addition to active contact pads 174-180, active contact vias190-196 which are further in electrical communication with active testpads 198-204. PCB 162 includes various dielectric layers 206 andinterior conductive layers 208 and 210, an example of which includesconductive layers for VDD, VDDQ, GND or other signals. The presentlyillustrated number of layers is exemplary and variations in layerquantity, structure and composition are also contemplated within thescope of the present invention.

PCB 162, in accordance with an embodiment of the present invention,further includes inactive test contacts 212 and 214 forming an array ofinactive contact pads 216 configured and fabricated as an extension toarray of active contact pads 172. Each of inactive test contacts 212 and214 includes an inactive contact pad 218 and 220, respectively, andinactive contact vias 222 and 224 further coupled to inactive test pads226 and 228. Inactive test contacts 212 and 214 are electrically coupledto a reference potential through a reference potential conductor 230internally or on one or both sides of PCB 162. By coupling inactive testcontacts to a reference potential, the capacitance presented to anactive test contact on the periphery of integrated circuit device 164more closely approximates the capacitance as seen at an interior activetest contact 182-188 when the internal capacitances 232 are electricallycoupled with the active test contacts 182-188 and the integrated circuitdevice undergoes characterization.

In yet another embodiment of the present invention, a second level ofinactive test pads 234 may further extend the electrical-consistencyfootprint of the array of active contact pads 172 to provide even moreuniform impedance characteristics to active contact pins at theperiphery of integrated circuit device 164.

FIG. 4 is a plan view of the top or first side 170 (see FIG. 3) of a PCB162, in accordance with an embodiment of the present invention. By wayof example and not limitation, array of contact pads 236 is configuredto receive a 90-pin BGA integrated circuit device for testing andcharacterization. Array of contact pads 236 is partitioned into a firstgroup of active contact pads 238 and a second group of inactive contactpads 240. It should be noted that inactive contact pads 240 are coupledto reference potential conductors 230, illustrated in FIG. 4A. In thepresent embodiment, array of contact pads 236, both inactive and activeportions, includes a reference potential grid 242 which is coupled tothe individual pads of an array of inactive contact pads 240 by way ofreference potential conductors 230.

FIG. 4 further illustrates another embodiment of the present inventionwherein a test coupon 266 is configured with an active test contact pad268 surrounded by a corresponding number of inactive test contact pads270 coupled to a reference potential by way of a reference potentialconductor, one of which is illustrated as reference potential conductor272. Test coupon 266 allows characterization of the intrinsiccapacitance and inductance of the specific structure and layout of thearray of conductive pads used for characterizing the integrated circuit.

FIG. 5 is a cross-sectional diagram of an alignment structure forimproving the testability of integrated circuit devices, in accordancewith an embodiment of the present invention. In the present embodiment,one contact, illustrated as a BGA contact 244, exhibits an improvedalignment with PCB 246 through the utilization of a solder mask 248 asapplied to the top or first surface 250 of PCB 246. As shown, soldermask 248 substantially covers the first surface 250 of PCB 246 andincludes via openings 252 to the active contact pad 254. In the presentembodiment, solder mask 248 provides a steeper profile for facilitatingan improved alignment of BGA contact 244 onto active contact pad 254. Byway of example and not limitation, solder mask 248 may be a dry soldermask or of another form configured to provide an improved alignment ofvarious integrated circuit devices by reducing coupling misalignmentduring the coupling of an integrated circuit device to a PCB.

FIG. 6 illustrates compensating componentry which further standardizesimpedance inserted between an integrated circuit device and a testerduring characterization of an integrated circuit device. It isappreciated in the testing environment that once test signals reach acertain frequency, inductance within the PCB begins to contribute to themeasured impedance between an integrated circuit device and testequipment. For illustrative purposes, FIG. 6 depicts a typical inverterinput 256 of an integrated circuit device. During testing of anintegrated circuit device, an RF input signal may be applied by testequipment at input 256 with the RF input signal passing throughcapacitor paths 258 and 260, resulting in a series-coupled impedance ofa capacitor and an inductor in each path which causes an increasedimpedance. For impedance characterization purposes, it is desirable toclamp the impedance introduced by the PCB structure during highfrequency testing. In yet another embodiment of the present invention, aseries-configured resistor 262 and a capacitor 264 are coupled betweenthe power signals and the ground signal to counteract the effects of theinductance of the PCB during high frequency testing of the integratedcircuit device.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope thereof as defined by the following appendedclaims.

1. A method of characterizing an integrated circuit device, comprising:forming a printed circuit board including a first conductive side forcoupling with said integrated circuit device and a second conductiveside for coupling with test equipment, said printed circuit boardfurther including an array of substantially similar test contactspassing from said first conductive side to said second conductive sideand partitioned into an active portion configured for electricallycoupling with a corresponding plurality of pins on said integratedcircuit device and an inactive portion adjacent to said active portion,said inactive portion electrically coupled to a reference signal on saidprinted circuit board; coupling said plurality of pins on saidintegrated circuit device with said active portion of said testcontacts; and coupling test equipment to said active portion of saidtest contacts on said second conductive side for characterizing saidintegrated circuit device.
 2. The method of claim 1, wherein: saidforming further comprises forming a test coupon on said printed circuitboard, said test coupon including at least one active test contactsurrounded by a plurality of inactive test contacts configured formeasuring at least one signal characteristic between said at least oneactive test contact and said plurality of inactive test contacts, saidtest contacts of said test coupon arranged substantially similar to saidarray of test contacts of said printed circuit board; and characterizingsaid test coupon to determine an intrinsic impedance of said array oftest contacts of said printed circuit board.
 3. The method of claim 1,further comprising: determining an inductance at a test equipment signalfrequency between said first and second conductive sides of said printedcircuit board; and electrically coupling between said first and secondconductive sides a series-coupled resistor and capacitor to counteractsaid inductance.
 4. A method of manufacturing a printed circuit boardfor characterizing an integrated circuit device, comprising: forming atleast one substantially planar dielectric including a first side and asecond side; forming a two-dimensional array of substantially similartest contacts wherein each of said test contacts, includes: forming avia through said at least one dielectric; forming a contact pad on saidfirst side of said at least one dielectric; forming a test pad-on saidsecond side of said at least one dielectric; electrically coupling saidcontact pad and said test pad through said via; and electricallycoupling an inactive portion of said array of substantially similar testcontacts to a reference signal on said printed circuit board, said arrayof substantially similar test contacts including an active portionconfigured for electrically coupling with a corresponding plurality ofpins on said integrated circuit device and an inactive portion adjacentto said test contacts of said active portion.
 5. The method of claim 4,wherein said inactive portion is arranged adjacent to at least one testcontact of said active portion surrounded by fewer than four other testcontacts from said active portion.
 6. The method of claim 5, whereinsaid inactive portion of said array of substantially similar testcontacts further includes at least one additional row of test contactswithin said inactive portion arranged adjacent to ones of said testcontacts in said inactive portion that are adjacent to said testcontacts of said active portion.
 7. The method of claim 4, furthercomprising forming a test coupon about said at least one dielectric,including forming at least one active test contact surrounded by aplurality of inactive test contacts concurrent with said forming saidtest contacts for measuring at least one signal characteristic betweensaid at least one active test contact and said plurality of inactivetest contacts, said test contacts of said test coupon arrangedsubstantially similar to said two-dimensional array of test contacts. 8.The method of claim 4, further comprising: determining an inductance ata test equipment signal frequency between said first and second sides ofsaid at least one dielectric of said printed circuit board; andelectrically coupling between said first and second sides aseries-coupled resistor and capacitor to counteract said inductance. 9.The method of claim 4, wherein forming a contact pad further comprisesforming said contact pad to receive a ball grid array of said integratedcircuit device.
 10. The method of claim 9, further comprising forming adry etch solder mask on said first side having a corresponding pluralityof apertures for receiving said ball grid array of said integratedcircuit device over said active portion of said test contacts.